This presentation provides an overview of Laser Direct Structuring (LDS) as a key technology for integrating electrical functionality directly into three-dimensional plastic components. It explains the LDS process, compares it with conventional PCB manufacturing, and highlights where LDS offers clear advantages in miniaturization, design freedom, functional integration, and assembly simplification. A broad range of application examples, from consumer electronics and mobile device antennas to automotive lighting, security casings, MEMS packages, and thermal management solutions—illustrates the versatility of LDS. The presentation also introduces the Envalior LDS material portfolio, detailing performance, processing windows, reliability, and assembly compatibility, and demonstrates how LDS enables innovative “out-of-the-box” solutions such as integrated heat management and combined laser welding and structuring (WeLDS).