The transition toward 800V HVDC architectures and rising power densities driven by AI workloads are redefining safety and reliability requirements in modern data centers. Power connectors, interconnect systems, thermal management, and power distribution components must now operate under higher voltages, temperatures, and continuous loads, leaving little margin for material related failures.

This session explores material solutions for key sub systems in AI data centers, including interconnect systems, thermal management components, and power distribution hardware. You will learn how advanced thermoplastic materials can improve electrical safety, thermal stability, and long term reliability while supporting compact designs and scalable manufacturing.